Until now, the non-destructive image analysis of many materials at depths greater than ~200µm with optical technologies was not achievable.
TeraView’s TPI™ imaga family of THz imaging systems combine powerful, ultra-fast Ti-Sapphire laser sources and semiconductor based detection systems with time-domain measurements to probe at depths of 3 mm or greater, depending upon the matrix properties. For many materials, chemical and 3D mapping results are obtained in 20 minutes or less.
- Non-destructive imaging of fibrous, powdered or densely packed materials, laminates, paints and coatings, semiconductors, ceramics, explosives and tissue
- Non-destructive, 3D volumetric imaging of tablet coatings and cores
- Solid-state emitter and detector for ambient temperature operation
- Bespoke optics casing with controlled alignment optics for system optimization
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