Non-Destructive Fault Localization in Fan Out Wafer Level Packages Using Electro Optical Terahertz Pulse Reflectometry
Rho, Kyungsoo, Jongmin Lee, Daejin Kim, Thomas White, and Jesse Alton. “Non-Destructive Fault Localization in Fan Out Wafer Level Packages Using Electro Optical Terahertz Pulse Reflectometry.” In 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), pp. 1-4. IEEE, 2018.
Abstract
Here, we demonstrate how electro optical terahertz pulse refiectometry (EOTPR), a time-domain refiectometry technique that utilizes terahertz frequency electrical pulses to identify device faults, can be used to quickly and non-destructively isolate faults in advanced fan-out wafer level (FOWL) packages. We present a case study to show how EOTPR can accurately locate faults in the densely spaced redistribution layers (RDLs) of the package.