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EOTPR

Electro Optical Terahertz Pulse Reflectometry: The world’s fastest and most accurate fault isolation system.

The EOTPR 3000 system is configured with a manual probe station to meet today’s tough FA environment which requires to isolate fault location in minutes rather than hours or days, while maintaining the EOTPR’s world leading sub-5 μm fault isolation accuracy.

Key Features

  • Manual probe station for quick sample runs
  • Data acquisition time of less than 5 sec. per pin.
  • User friendly software to capture data.
  • Uses GGB high frequency probe tips.
  • Supports any pitches between 50 μm to 1.1 mm.
  • Less than 5 μm distance-to-defect fault isolation accuracy.
Product Features
  • Patented technology.
  • More than 270 mm signal penetration into DUT.
  • Improved SNR over EOTPR 2000.
Technical Specification
EOTPR pulse rise time 6 ps (based on processed data) Defined as the time for the reflected impulse from the end of the high frequency probe to rise from 10% to 90% of its maximum value
Accuracy Able to locate a feature on 50 Ω coplanar waveguide positioned close to the high frequency probe with precision of ± 5 µm
Range Up to 270 mm from contact with probe in a typical package
Input Impedance 50 Ω nominal
Signal to noise 94 dB
Laser stabilisation Laser power stabilisation prevents laser power fluctuations during measurement
Measurement time Rapid scan delay line offers measurement times of less than 5 seconds per pin
Time-based jitter < 30 femtoseconds

The EOTPR 4000 system is configured with an automated probe station which is capable of placing the probe tip to +/- 5 μm precision, while maintaining the EOTPR’s world leading sub-5 μm fault isolation accuracy.

This combination allows users to directly probe TSV tips and copper pillars.

Key Features

  • Pre-scan station to map contact location and height.
  • Data acquisition time of less than 5 seconds per pin.
  • Software that will drive the automated probe station and pre-scan station.
  • Availability of both manual mode and automated mode for probing.
  • User interface software to manage data display and recipe creation.
  • Probe tip placement.

Key Components
  • 5 μm accuracy auto-prober.
  • Pre-scan station for contact point mapping.
  • Automated probe station that can also be operated in manual mode.
  • EOTPR probe head.
Core Unit
THZ source Laser gated photo-conductive semiconductor emitter
THz detector Laser-gated photo-conductive semiconductor detector
Laser Ultra short pulsed laser
A/D converter 16 bit
TDR pulse rise time 6 ps (based on processed data) Defined as the time for the reflected impulse from the end of the high frequency probe to rise from 10 % to 90 % of its maximum value
Accuracy Able to locate a feature on 50 Ω coplanar waveguide positioned close to the high frequency probe with precision of ± 5 µm
Range Up to 270 mm from contact with probe on a 50 Ω strip line
Input impedance 50 Ω nominal
Channel input connector 1 mm
Probe configuration In addition to fitting within the TeraView supplied station, the probe is suitable for mounting on the Alessi REL-4800 parametric probe station made by Cascade Microtech (not supplied)
Dimensions (ex. probe station) 600 mm (w) x 1320 mm (h) x 1000 (d) mm
Weight (ex. probe station) 220 kg (480 lbs)
Electrical power requirements (ex. probe station) 90 VAC to 250 VAC, 47 to 63 Hz single phase
Operating temperature 18 °C (64 °F) to 30 °C (86 °F)
Operating humidity Up to 80 % (non-condensing)
Automated Probe Station
Probe station modes of operation Auto BGA probing (for BGA > 200 μm), semi-auto probing mode (see specifications below) or manual probing mode
Probe tip pitch 30 μm to 1.2 mm with compatible GGB and Cascade probes
Probe tip calibration Quick probe calibration to determine:
• Position of the signal and ground tips
• Probe tip pitch
Device under test size 5 mm x 5 mm to 70 mm x 70 mm
Device mounting Devices under test are mounted to the probe station with reusable Gel-Pack mounts
Device under test contact type Compatible with BGA, LGA and microbumps
Minimum solder ball diameter 30 μm (semi-auto mode)
Minimum LGA pad size 30 μm x 30 μm (semi-auto mode)
Device under test pre-scan time Less than 60 seconds (single 16 mm stripe)
Measurement time per pin Less than 5 seconds (no co-averaging)
Software A full software suite to enable data collection and analysis with the automated probe station
Data file format Data files will contain the
following information:
• Device name/type (user specified).
• Pin locations measured.
• Measured date.
• Task information/comments (user specified).
Microscope Microscope supplied with CCD camera
Dimensions (estimated) 1000 mm (w) x 1900 mm (h) x 900 (d) mm
Weight (estimated) 250 Kg
Environment As per the core unit

Watch the EOTPR 4000 demonstration above.

The EOTPR 5000 utilises TeraView’s proprietary EOTPR technology to detect interconnect quality with the full automation, rapid measurement speed and high throughput required in today’s high volume manufacturing environments. Moreover, it is the only IC interconnect inspection technique currently available that operates at the forefront of location accuracy and detection sensitivity.

Today’s advanced IC packages are susceptible to warpage-induced interconnect failures, including conditions such as head-in-pillow defects that occur in Package-on-Package (PoP) devices. These weak or marginal interconnect conditions may not be captured by logic or electrical testers.

Using the EOTPR 5000’s superior accuracy and sensitivity, users can now detect minute shifts in impedance from weak or marginal interconnects after accelerated life or high temperature cycle tests.  In this manner, manufacturing variations can be reduced, improving packaging-related yields.

Product Features
  • Fully automated probing, recipe creation and service/maintenance mode.
  • Compatible with BGA’s in the range of 400 µm to 1 mm.
  • Automatic probe calibration to determine the position of the signal and ground probe tips.
  • A full software suite to enable data collection and analysis.
  • Supports SECS/GEM factory automation interfaces.
  • Fully automated device binning capability.
System Specifications
Dimensions 2130 mm (w) x 1700 mm (h) x  960 mm (d) (excluding JEDEC tray loader)
Weight (approximate) 1000 kg
Electrical Power Requirements 1 x 32 amp, 220 volt supply
Compressed Air Requirements 1 x at 60 – 80 psi
EOTPR Capabilities
EOTPR pulse rise time 6 ps (based on processed data) Defined as the time for the reflected impulse from the end of the high frequency probe to rise from 10% to 90% of its maximum value
Accuracy Able to locate a feature on 50 Ω coplanar waveguide positioned close to the high frequency probe with precision of ± 5 µm
Range Up to 200 mm from contact with probe in a typical package
Input Impedance 50 Ω nominal
Channel Input Connector 1 mm
Fully Automated Features
Modes of operation Full automated probing, recipe creation and service/maintenance mode
Probe type Compatible with commercially available high frequency probes
BGA pitch Supports BGA pitches from 400 μm to 1 mm
Probe calibration Automatic probe calibration
Device under test dimensions Minimum: 5 mm x 5 mm
Maximum: 35 mm x 35 mm
Device handling Devices are loaded on to the system via JEDEC trays
Device identification 2D barcode reader
Minimum BGA diameter 200 μm
Measurement time per pin 0.5 seconds
Software A full software suite will be provided to enable data collection and analysis
Software operating system Windows Server 2012
Integration with factory automation Software can be tailored to meet customer specific factory automation requirements
Environment Class 10,000 clean room compliant
Operating temperature range: 18 °C (64 °F) – 30 °C (86 °F)
Temperature stability ±2 °C
Operating humidity: 20 – 80%
(non condensing)
EMC Compliant with SEMI standard E33
SEMI standard compliance System is compliant with SEMI standards S2, S8, and E33

The EOTPR QuickSim is a simulation tool for EOTPR users which can ease the interpretation of the EOTPR waveforms.  This is a software package that can quickly and accurately simulate the EOTPR waveform recorded from a known good device sample measurement.

The software requires only limited DUT (Device Under Test) information to generate an accurate model (e.g. trace length) and does not require the full 3D design file of the DUT.

Once generated and optimised, models can be used to accurately locate faults in a failed device.

Simulation Steps

  1. Import measured EOTPR waveforms
  2. Construct circuit model of device (typically < 5 minutes)
  3. Perform optimisation (typically < 1 minute)
  4. Extract fault location

Watch the film below for a demonstration of the software.

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