Recent Developments in EOTPR Towards a Fully Automated Tool for High Volume Failure Analysis

Developments in backside power delivery (BPD) technology will become increasingly important for advanced semiconductors, but will present new challenges for failure analysis (FA) labs. Electro-Optical TeraHertz Pulsed Reflectometry (EOTPR) is a well-established electrical FA technique for package level open and leakage faults, but has comparatively little use for detecting die-level faults. Here, two case studies are presented that demonstrate how EOTPR can be used to localize faults within a die, highlighting how EOTPR could be utilized for BPD devices. Recent and future key developments in EOTPR are also presented.