TeraView secures additional orders and patent protection in HBM and AI chip inspection

TeraView, the pioneer and leader in terahertz technology and solutions, is pleased to announce new orders from one of its Fortune 500 customers that supply high bandwidth memory (HBM) to AI chip manufacturers. In a related development, the Company has secured key IP in Korea to add further protection for automated EOTPR 4500 product used in HBM and AI chip inspection.

TeraView has secured a multi-year support contract to ensure the on-going implementation of TeraView’s existing EOTPR systems at one of its customers US production sites for HBM. This repeat purchase by one of the world’s most rapidly growing HBM manufacturers demonstrates the criticality of TeraView’s EOTPR product in the development and quality assurance in production of HBM3 and HBM4 memory for this HBM customer.

The use of EOTPR in HBM3 and HBM4 development and test & measurement workflow has made it an indispendible tool for all of the major HBM manufacturers in Korea, the US and throughout the world.

In an earlier public announcement from NVIDIA in 2025, NVIDIA stated that EOTPR is now being used as a ‘first-in-line’ priority technology in their work-flow for failure analysis and test & measurement of AI chips, and that they would work with their suppliers to implement EOTPR in supplier production processes. This multi-year contract underscores the fact that NVIDIA suppliers are relying on TeraView EOTPR to meet NVIDIA’s expectations.

In a related development, the Korean patent office has recently announced that it intends to grant TeraView’s Korean Patent Application No. 10-2018-7020701. This patent covers the automated probing system used in the EOTPR 4500 supplied to Korean customers and is a key component for use in future fully automated systems in AI chip production. This grant follows on from similar grants of this patent in the US and Taiwan.

Don Arnone, TeraView’s CEO, stated “The recent market announcement from NVIDIA of rapid revenue growth in their AI chip sales, as well as forecasts for double digit growth in AI and HBM3/4 chip sales over the next several years, are mirrored in our recent order in-take from this Fortune customer as well as all of the major Korean HBM providers.  These sales support forecasts of robust growth in TeraView EOTPR orders going forward. TeraView has now established growing order books from all of the major Korean and US HBM providers. This is because EOTPR as the only product capable of inspecting 3D packaging technology at the heart of AI chips. Our new Korean patent is another step towards full automation of our EOTPR technology as well as a significant barrier to entry to any future competitor.”