Newsletter – July 2022

Newsletter | July 2022 TeraView launch a new product to address the growing needs in advanced IC packaging TeraView is pleased to announce the launch of the purpose-built integrated circuit package inspection system, the EOTPR 4500. Dr Jesse Alton, Semiconductor...

Polymer pellet fabrication for accurate THz-TDS measurements

Polymer pellet fabrication for accurate THz-TDS measurements AbstractWe investigate fabrication of compacts using polytetrafluoroethylene (PTFE) and polyethylene (PE), and the effect of compaction conditions on their terahertz transmission properties. The conditions...