TeraView collaborates with a major HBM customer to deliver high precision probing solutions for key components of AI chips

TeraView, the pioneer and leader in terahertz technology and solutions, is pleased to announce an important milestone in its development programme with a major Fortune 500 customer that supplies high bandwidth memory (HBM) to AI chip manufacturers. This is expected to lead to additional orders in the near term with this and other HBM and AI chip manufacturers.

With specifications and testing provided by its customer, TeraView has dramatically increased the accuracy and precision of the probing capability in its EOTPR HBM/AI chip inspection tool down to contact pad sizes of 5mm. This means that through-silicon-vias (TSVs), a fundamental building block connecting the rapidly growing number of stacked silicon layers in the HBM, can now be directly probed with EOTPR. HBM3E currently uses down to ~5mm, with HBM4 expected to start with similar contact pad sizes but to then see reductions due to increased integration in HBM4 devices.

TeraView’s innovation is being added to its EOTPR 4500 inspection system and has already been installed and successfully tested by the leading US memory manufacturer. The manufacturer is already a substantial repeat customer of TeraView’s EOTPR product which it uses as an integral part of its test & measurement of HBMs provided to the world’s two largest AI chip manufacturers.

In an earlier public announcement from NVIDIA in 2025, NVIDIA stated that EOTPR is now being used as a ‘first-in-line’ priority technology in their work-flow for quality assurance and failure analysis of AI chips, and that they would work with their suppliers to implement EOTPR in supplier production processes.

The installation of this high accuracy EOTPR probing solution on the systems of TeraView US HBM manufacturer will now be followed by additional deployments at this customers production sites globally, as well as with major Korean HBM manufacturers who are also TeraView customers.

As HBM generations progress (HBM3E, HBM4), the TSV diameter and pitch continue to shrink to support higher I/O densities. The use of EOTPR in HBM3 and HBM4 development, yield optimisation and test & measurement workflow has made it an indispendible tool for all of major HBM manufacturers in Korea, the US and globally. TSVs – along with them, EOTPR – will continue to be indespensible as existing (m bump) and new (hybrid) bonding technologies are introduced to connecting the increasingly large number of stacked silicon layers in HBM.

To publicise the new capabilities of the EOTPR 4500, TeraView is participating in Semicon Korea in Seoul from 11-13 February 2026.

Dr. Don Arnone, TeraView’s CEO, stated “This collaboration with one of the world’s largest and fastest growing HBM providers to introduce state-of-the-art EOTPR probing technology is a perfect example of how TeraView continues to develop its procucts directly with its customers, ensuring that we meet market needs. The recent announcement from NVIDIA of rapid revenue growth in their AI chip sales, and double digit growth in AI and HBM3/4 chip sales over the next several years, are mirrored in our recent order in-take from this Fortune customer as well as other major Korean HBM providers. The successful testing completed with this customer will drive additional sales from them in the short-term, and sales to other HBM and AI chip manufactuers thereafter, who have the same probing requirement.  Our ability to innovate and deliver against a roadmap of improvements to match the AI-driven development of HBM by our customers makes TeraView a natural partner for HBM manufacturing.”