Non-Destructive Short Fault Localization in Advanced IC Packages Using Electro Optical Terahertz Pulse Reflectometry
Zee, B., W. Qiu, J. Alton, T. White, M. Igarashi, and D. Sullivan. “Non-Destructive Short Fault Localization in Advanced IC Packages Using Electro Optical Terahertz Pulse Reflectometry.” In ISTFA 2019: Proceedings of the 45th International Symposium for Testing and Failure Analysis, p. 9. ASM International, 2019.
We demonstrate how electro optical terahertz pulse reflectometry (EOTPR) can be used in conjunction with a new one-dimensional lump circuit simulation software to quickly and non-destructively isolate faults in advanced IC packages. In the case studies presented, short failures are accurately located in a series of advanced IC package.