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Newsletter | March 2021

UK Research & Innovation invest in TeraView’s
6G technology

TeraView is pleased to announce that it has won development funding from the Sustainable Innovation Fund with Innovate UK, the United Kingdom’s innovation agency. This funding is specifically targeted at TeraView’s cutting edge technology for next generation 6G network applications.

TeraView has a vision to use its expertise and intellectual property to develop the building blocks of future 6G networks, which will use terahertz (THz) frequencies. As a knowledge and IP-rich company with decades of experience operating at THz frequencies, TeraView can bring the breadth and depth of its experience to accelerate the development of 6G.

Wireless connectivity is increasingly an important component of society and people’s everyday lives. The exponential growth in demand for high bandwidth applications such as multimedia streaming, the Internet of Things, control of autonomous vehicles and cloud computing has triggered the need for development of new technologies to provide high-bandwidth, reliable links in wireless environments, a key goal of future 6G networks. Uniquely 6G is also targeted to deliver other functions such as accurate positional information and imaging to support applications such a virtual reality.

The full press release is available to view here.

TeraView and NVIDIA publish joint paper

TeraView is pleased to announce the joint publication of a paper between teams from NVIDIA and TeraView Ltd in the UK. The paper was presented by Dr. Chuan Zhang from NVIDIA at the virtual Electronics Device Failure Analysis Society (EDFAS) workshop, which was held between December 5-7, 2020.

The paper titled, “Localization and Characterization of Defects for Advanced Packaging Using Novel EOTPR Probing Approach and Simulation”, was the result of a collaboration between the two companies.  This joint publication discusses the capability of TeraView’s patented Electro Optical Terahertz Pulse Reflectometry (EOTPR) technology and its simulation technology, QuickSim, to quickly and accurately isolate fault locations. 

The full details of the article can be viewed here.

Demonstration Videos

The demonstration film above shows how to prepare high quality sample pellets for terahertz spectroscopy for reproducible measurements, avoiding etalon reflections and maintaining good spectral resolution and bandwidth. The techniques shown are applicable to a wide variety of applications in materials characterisation, pharmaceuticals and other applications.
The TeraPulse Lx system can be viewed on our website here.

Calmar Laser

TeraView’s TeraPulse Lx system now contains Calmar Laser’s high powered Mendocino fiber laser module.
With over 25 years of experience, Calmar’s world-leading ultrafast fiber laser solutions ensure reliable and robust integration into TeraView’s systems.

For more information contact TeraView or Calmar Laser directly.

Select Papers

Defect Localization in Through-Si-Interposer Based 2.5D ICs

Gourikutty, Sajay Bhuvanendran Nair, Yew Meng Chow, Jesse Alton, Ratan Bhimrao Umralkar, Haonan Bai, Kok Keng Chua, and Surya Bhattacharya. “Defect Localization in Through-Si-Interposer Based 2.5 D ICs.” In 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), pp. 1180-1185. IEEE, 2020.


Advanced packaging solutions using Through Silicon Interposers (TSI) are an attractive option to create 2.5D ICs. In many applications such as GPU and FPGA, 2.5D ICs can overcome the power, performance, and form-factor limitations of traditional IC packages. Investigating yield-loss and reliability mechanisms of such packages is made particularly challenging by the multitude of possible failure locations such as in TSV, micro-bumps, underfill, solder ball joints and RDL layers. Existing electrical and physical failure analysis tools do not have adequate resolution to accurately localize the failure in 2.5D IC. In this paper, we present a non-destructive methodology to carry out the failure analysis by localizing the defects which are entirely internal to the package and inaccessible from the exterior. In a through silicon interposer based FPGA package, a short failure has been successfully located with an accuracy of less than 10μm without the need for any sample preparation. The testing, fault localization and physical failure analysis of advanced package demonstrated here will provide a cost-effective method for improving manufacturing yield.
Full article available here.

Anharmonicity-driven redshift and broadening of sharp terahertz features of α-glycine single crystal from 20 K to 300 K

Allen, J. L., T. J. Sanders, Josip Horvat, and R. A. Lewis. “Anharmonicity-driven redshift and broadening of sharp terahertz features of α-glycine single crystal from 20 K to 300 K: Theory and experiment.” Spectrochimica Acta Part A: Molecular and Biomolecular Spectroscopy 244 (2020): 118635.


For the first time, large single crystals of the simplest amino acid, glycine, have been used to determine the temperature dependence of its terahertz spectrum. High-quality spectra with very sharp absorption features are observed at cryogenic temperatures. The α-glycine structure and the purity of the crystals were verified via Raman spectroscopy and X-ray diffraction. Spectral redshift with increasing temperature was observed for all absorption bands in the terahertz region (10–250 cm−1, or 1–8 THz) over the temperature range of 20–300 K. X-ray diffraction revealed expansion in all planes of the crystal lattice over the same temperature range. A Bose-Einstein distribution was used to model the frequency position shift of the two lowest-energy fundamental modes at 50 cm−1 and 69 cm−1. On this basis, we attribute the observed redshift and broadening with increasing temperature to the anharmonic potential associated with the phonon bath.
Full article available here.

Would you like to partake in an online workshop?

TeraView are looking at conducting online workshops in 2021
Contact us if you are interested